• DocumentCode
    3470634
  • Title

    An electro-magneto-pneumatic spring for vibration control in semiconductor manufacturing

  • Author

    Kim, HyungTae ; Lee, KangWon ; Kim, CheolHo ; Lee, GyuSeop ; Son, SungWan

  • Author_Institution
    Manuf. Syst. Div., KITECH, ChungNam
  • fYear
    2009
  • fDate
    14-17 April 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    An active vibration isolator was developed for semiconductor manufacturing machines using electro-magnetic (EM) levitation force. The spring is composed of a pneumatic elastic chamber and a magnetic actuator. The actuator has a coil and a permanent magnetic plate and is installed inside of the chamber. The mechanical and electronic parts are designed to operate under a weight of 2.0 tons. An air mount is constructed for the experiment with a stone surface plate, 4 active air springs, 4 gap sensors, a DSP controller, a linear power amp and vibration measurement systems. The impulse response of the air mount was monitored before and after the active control. The time duration was reduced by 77% in the impulse response. The maximum peak in frequency domain was reduced by 62%. We also found that the active system can avoid the resonance caused by the natural frequency of the passive system.
  • Keywords
    electromagnetic actuators; frequency-domain analysis; magnetic levitation; semiconductor device manufacture; springs (mechanical); transient response; vibration control; DSP controller; active air springs; active vibration isolator; air mount; electro-magnetic levitation force; electro-magneto-pneumatic spring; frequency domain; gap sensors; impulse response; linear power amp; magnetic actuator; permanent magnetic plate; pneumatic elastic chamber; semiconductor manufacturing; stone surface plate; vibration control; vibration measurement systems; Coils; Isolators; Magnetic levitation; Magnetic semiconductors; Magnetic sensors; Magnetoelasticity; Pneumatic actuators; Semiconductor device manufacture; Springs; Vibration control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics, 2009. ICM 2009. IEEE International Conference on
  • Conference_Location
    Malaga
  • Print_ISBN
    978-1-4244-4194-5
  • Electronic_ISBN
    978-1-4244-4195-2
  • Type

    conf

  • DOI
    10.1109/ICMECH.2009.4957191
  • Filename
    4957191