• DocumentCode
    3470837
  • Title

    Applied voltage dependence of hotspot location and temperature in power Si MOSFET

  • Author

    Kibushi, Risako ; Hatakeyama, T. ; Nakagawa, Sachiko ; Ishizuka, M.

  • Author_Institution
    Dept. of Mech. Syst. Eng., Toyama Prefectural Univ., Imizu, Japan
  • fYear
    2013
  • fDate
    11-13 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In recent years, thermal problem of electronics has been serious, and accurate thermal design has been required. In conventional thermal design of power Si MOSFET, which is widely used semiconductor device for current control in a lot of area, uniform heat generation has been assumed, and designer has employed average temperature of power Si MOSFET. However, for more accurate thermal design, the non-uniform temperature distribution of power Si MOSFET should be considered. In this study, we performed electro-thermal analysis to investigate non-uniform temperature distribution of power Si MOSFET, and discussed applied voltage dependence of hotspot location and its temperature. The calculation results showed, although applied voltage dependence of hotspot temperature of power Si MOSFET is complex, hot spot appears almost the same location in any applied voltage condition.
  • Keywords
    elemental semiconductors; power MOSFET; silicon; temperature distribution; Si; applied voltage dependence; electro-thermal analysis; hotspot location; hotspot temperature; nonuniform temperature distribution; power Si MOSFET; Electrodes; Equations; Heating; Lattices; MOSFET; Mathematical model; Silicon; Electro-thermal analysis; Hotspot; Power Si MOSFET;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-2718-0
  • Type

    conf

  • DOI
    10.1109/ICSJ.2013.6756107
  • Filename
    6756107