DocumentCode
3470837
Title
Applied voltage dependence of hotspot location and temperature in power Si MOSFET
Author
Kibushi, Risako ; Hatakeyama, T. ; Nakagawa, Sachiko ; Ishizuka, M.
Author_Institution
Dept. of Mech. Syst. Eng., Toyama Prefectural Univ., Imizu, Japan
fYear
2013
fDate
11-13 Nov. 2013
Firstpage
1
Lastpage
4
Abstract
In recent years, thermal problem of electronics has been serious, and accurate thermal design has been required. In conventional thermal design of power Si MOSFET, which is widely used semiconductor device for current control in a lot of area, uniform heat generation has been assumed, and designer has employed average temperature of power Si MOSFET. However, for more accurate thermal design, the non-uniform temperature distribution of power Si MOSFET should be considered. In this study, we performed electro-thermal analysis to investigate non-uniform temperature distribution of power Si MOSFET, and discussed applied voltage dependence of hotspot location and its temperature. The calculation results showed, although applied voltage dependence of hotspot temperature of power Si MOSFET is complex, hot spot appears almost the same location in any applied voltage condition.
Keywords
elemental semiconductors; power MOSFET; silicon; temperature distribution; Si; applied voltage dependence; electro-thermal analysis; hotspot location; hotspot temperature; nonuniform temperature distribution; power Si MOSFET; Electrodes; Equations; Heating; Lattices; MOSFET; Mathematical model; Silicon; Electro-thermal analysis; Hotspot; Power Si MOSFET;
fLanguage
English
Publisher
ieee
Conference_Titel
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location
Kyoto
Print_ISBN
978-1-4799-2718-0
Type
conf
DOI
10.1109/ICSJ.2013.6756107
Filename
6756107
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