Title :
Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating
Author :
Weixin Fu ; Mizuno, Jun ; Shoji, Shuji ; Kasahara, T. ; Okada, Atsushi ; Ishizuka, Shuhei
Author_Institution :
Waseda Univ., Tokyo, Japan
Abstract :
A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.
Keywords :
bonding processes; coatings; copper; nanoparticles; shear strength; silver; sintering; Ag; Cu; bonding method; bump coating structure; flexible incomplete-sintered nanoparticle layer; pressure 118 MPa; shear strength; squeegee-coating method; Annealing; Bonding; Nanoparticles; Periodic structures; Substrates; Three-dimensional displays; Ag nanoparticle bump; low temperature bonding; squeegee-coating method;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756116
