Title :
Thermal reliability of Ag-8Au-3Pd alloy wire bonds
Author :
Rui Guo ; Cheng Yin ; Dali Mao ; Ming Li ; Zhong Lv ; Chiu, Huang-Jen
Author_Institution :
Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
Ag-8Au-3Pd alloy wire has great potential of low-cost candidate for traditional gold wire interconnects. This study aims to light the behavior of degradation that took place in Ag-8Au-3Pd alloy wire bond interface. Two layers of intermetallic compound (IMC) at the Ag-8Au-3Pd/Al bond interface were observed by transmission electron microscopy (TEM). The specimens were annealed at 175°C in a closed oven for 24, 72, 168, 336 and 500 h in atmosphere respectively to reveal the evolution of IMC at interface. The high-temperature storage (HTS) test of Ag-8Au-3Pd/Al Ag-95Pd-5/Al and Ag-98Pd-2/Al interface was conducted for contrast. Interface evolution tracking by back scattered electron (BSE) imaging showed that after 336 h, the bonding interface began to fail. JEDEC standard of HTS test was successfully passed. Ag-8Au-3Pd wire showed great promise as an economical substitute for gold wire.
Keywords :
aluminium; annealing; electron backscattering; gold alloys; interconnections; palladium alloys; reliability; silver alloys; transmission electron microscopy; wires; Ag-8Au-3Pd alloy wire bonds; Ag-8Au-3Pd/Al bond interface; AgAuPd-Al; Interface evolution tracking; JEDEC standard; TEM; annealing; back scattered electron imaging; degradation behavior; gold wire interconnects; high-temperature storage test; intermetallic compound; temperature 175 degC; thermal reliability; time 24 h to 500 h; transmission electron microscopy; Atomic measurements; Bonding; Gold; Intermetallic; Reliability; Wires; Ag-8Au-3Pd alloy wire; BSE; BST; IMC evolution; annealing; ball bond;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756121
