Title :
A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide
Author :
Fujita, Masayuki ; Anzai, Nobuyuki ; Sakamaki, Kazutoshi ; Kariya, Yoshiharu
Author_Institution :
Fab Mater. R&D Dept., Asahi Kasei E-Mater. Corp., Fuji, Japan
Abstract :
Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.
Keywords :
buffer layers; conducting polymers; finite element analysis; integrated circuit reliability; stress effects; board level drop reliability test; buffer function; finite element analysis; polyimide layer; polyimide modulus; polyimide thickness; stress buffer effect; stress responses; Analytical models; Finite element analysis; Integrated circuit modeling; Polyimides; Strain; Stress; Drop Test; Finite Element Analysis; Polyimide;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756126
