Title :
CMP service for prototyping and low volume production
Author :
Torki, Kholdoun ; Courtois, Bernard
Author_Institution :
Circuits Multi-Projects, Grenoble
Abstract :
CMP aims at providing universities, research laboratories and industries with the possibility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8, DLM/TLM 0.6mu, DLP/4LM 0.35mu, SLP/6LM 0.18mu, SLP/6LM 0.13mu, SLP/7LM 90nm, BiCMOS DLP/DLM 0.8mu, SiGe 0.35mu SLP/5LM, SiGe:C 0.25mu SLP/5LM and GaAs HEMT 0.2mu. About 40 multi-project runs are offered per year. Micro electro mechanical systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8mu 0.6mu, BiCMOS DLP/DLM 0.8mu and HEMT GaAs 0.2mu, using compatible front-side bulk micro-machining. MUMPS processes are offered as surface micro-machining allowing integrating MEMS only microstructures
Keywords :
BiCMOS integrated circuits; gallium arsenide; integrated circuit design; micromachining; micromechanical devices; prototypes; BiCMOS technology; CMOS double layer metal; CMOS double layer poly; Circuits Multi-Projects; GaAs; bulk micromachining; integrated circuits projects; low volume production; microelectromechanical systems; surface micromachining; BiCMOS integrated circuits; Educational institutions; Gallium arsenide; HEMTs; Laboratories; Micromechanical devices; Production; Prototypes; Silicon germanium; Textile industry;
Conference_Titel :
ASIC, 2005. ASICON 2005. 6th International Conference On
Conference_Location :
Shanghai
Print_ISBN :
0-7803-9210-8
DOI :
10.1109/ICASIC.2005.1611509
