Title :
Model-based product quantity control
Author :
Ramakrishnan, V. ; Walker, D.M.H.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Abstract :
A methodology for building Response Surface Models (RSM) for product quantity control of integrated circuits is presented. A simulation based approach is used to build the models. The work focuses on controlling the number of wafer starts devoted to each product based on in-line, in-situ and Wafer-level Electric Tests (WET). Real-time decisions are made depending on the demand for a particular performance bin
Keywords :
integrated circuit manufacture; integrated circuit testing; quality control; semiconductor process modelling; in-line tests; in-situ tests; integrated circuits; performance binning; product quantity control; real-time decisions; response surface model; simulation; wafer-level electric tests; Buildings; Circuit simulation; Circuit testing; Fabrication; Integrated circuit modeling; Integrated circuit testing; Manufacturing processes; Performance evaluation; Response surface methodology; Semiconductor device modeling;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526192
