DocumentCode
3471558
Title
P2ID 2002 industry survey of semiconductor process-induced damage
Author
Hook, T. ; Eriguchi, Koji ; Thuy Dao ; Alba, S. ; Aum, P.
Author_Institution
STMicroelectronics
fYear
2003
fDate
24-25 April 2003
Firstpage
108
Lastpage
121
Abstract
This is the first international semiconductor industry survey regarding PID ("Process Induced Damage") on semiconductor devices by P2ID. The purpose of P2ID is in understanding and managing PID issues faced by the semiconductor industry.
Keywords
integrated circuit manufacture; radiation effects; semiconductor technology; surface charging; P2ID 2002 industry survey; PID issues; process induced damage; semiconductor industry; semiconductor process-induced damage; Computer aided manufacturing; Design engineering; Integrated circuit layout; Integrated circuit manufacture; Integrated circuit reliability; Manufacturing processes; Plasma applications; Plasma devices; Power engineering and energy; Reliability engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma- and Process-Induced Damage, 2003 8th International Symposium
Print_ISBN
0-7803-7747-8
Type
conf
DOI
10.1109/PPID.2003.1200934
Filename
1200934
Link To Document