Title :
A robust metric for measuring within-wafer uniformity
Author :
Davis, Joseph C. ; Gyurcsik, Ronald S. ; Lu, Jye-Chi ; Hughes-Oliver, Jacqueline ; Nychka, Douglas
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
A robust metric for measuring within-wafer uniformity has been developed and compared to the traditional SNR metric. The new statistic, referred to as the integration statistic, is based on the integration of the volumetric error between the target and the actual surfaces. Comparison with the traditional SNR uniformity metric indicates that the integration statistic provides a more consistent estimate of the uniformity for different numbers of measurements and different orientations of those measurements to the uniformity pattern
Keywords :
integrated circuit manufacture; integrated circuit measurement; SNR metric; integration statistic; orientation; robust metric; semiconductor wafer processing; volumetric error; within-wafer uniformity measurement; Area measurement; Condition monitoring; Error analysis; Gaussian distribution; Materials processing; Measurement standards; Process design; Robustness; State estimation; Statistical distributions; Statistics;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526193
