DocumentCode :
3471733
Title :
Effects of gate notching profile defect on characteristic of cell NMOSFET in low-power SRAM device
Author :
Seo, Sang-Hun ; Kim, Sung-Jin ; Yang, Won-Suk ; Ju, Jun-Yong ; Kim, Joo-Young ; Park, Seung-Hyun ; Kim, Seug-Gyu ; Kim, Kijoon
Author_Institution :
Memory Div., Samsung Electron. Co. Ltd., Gyeonggi-Do, South Korea
fYear :
2003
fDate :
24-25 April 2003
Firstpage :
146
Lastpage :
149
Abstract :
The effects of gate notching profile defects on transistor performance in cell NMOSFETs of low-power SRAM devices with 0.12 μm channel length were investigated. Experimentally, it was found that gate notching profile defects cause serious degradation of the transconductance and the transistor drive current. TSUPREM4 simulations showed that the degradation of transistor characteristics is related to the penetration of the gate notching into the channel region over the source/drain (S/D) extension region and the rapid reduction of gate electric field. Moreover, we found that the degradation of transistor performance is more sensitive to notch depth than notch height.
Keywords :
CMOS memory circuits; MOSFET; SRAM chips; low-power electronics; semiconductor device models; semiconductor device reliability; 0.12 micron; CMOS SRAM device; SiON-WSi-Si; TSUPREM4 simulations; cell NMOSFET; channel length; channel region; gate electric field reduction; gate notching penetration; gate notching profile defects; low-power SRAM device; notch depth; notch height; source/drain extension region; transconductance degradation; transistor characteristics degradation; transistor drive current degradation; Acceleration; Degradation; Etching; MOSFET circuits; Plasma sources; Random access memory; Scattering; Threshold voltage; Transconductance; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma- and Process-Induced Damage, 2003 8th International Symposium
Print_ISBN :
0-7803-7747-8
Type :
conf
DOI :
10.1109/PPID.2003.1200944
Filename :
1200944
Link To Document :
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