Title :
LSM vision gage R&R study
Author :
Messina, William S. ; Willey, Leslie G. ; Jones, Ken W.
Author_Institution :
Huntsville Electron., Chrysler Corp., Huntsville, AL, USA
Abstract :
The purpose of this study is to assess whether the laser scanning microscope (LSM) is capable of measuring solder paste height. The LSM projects a scanning laser beam onto the PC board which is deflected around the solder paste deposit. The height of the paste was determined by taking the difference between the highest (top) and lowest (bottom) laser deflection points on and surrounding the paste deposit respectively
Keywords :
measurement by laser beam; optical microscopy; optical scanners; printed circuit testing; production testing; soldering; thickness measurement; LSM; PC board; laser deflection points; laser scanning microscope; scanning laser beam; solder paste height; vision gage; Analysis of variance; Data analysis; Design for experiments; Laser beams; Manufacturing; Microscopy; Performance analysis; Resists;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526194
