DocumentCode :
3472218
Title :
5.8 GHz and 12.6 GHz Si bipolar MMICs
Author :
Voinigescu, S.P. ; Maliepaard, M.C.
fYear :
1997
fDate :
8-8 Feb. 1997
Firstpage :
372
Lastpage :
373
Abstract :
Wireless ATM in the 5 GHz band is the most recent addition to the family of multimedia applications. As in the case of lower-band and lower-speed wireless systems, the availability of low-cost silicon solutions is a prerequisite for its ubiquitous market presence. A family of circuits aimed at the wireless ATM and broadband multimedia applications is implemented in an implanted-base, double-poly Si bipolar technology. The process features bipolar transistors with f/sub T/, and f/sub MAX/ values of 24 GHz and 38 GHz, respectively at V/sub CE/=1 V. The minimum noise figure, NF/sub MIN/, is typically 2 dB at 5.5 GHz, while BV/sub CEO/ and BV/sub CBO/ are 4.2 V, and 15 V, respectively. The three-layer metallization with 2 /spl mu/m thick Al top layer allows for fabrication of inductors with Qs in the 6-10 range and microstrip and coplanar lines with Qs of 6 at 26 GHz. A 5.8 GHz double-balanced mixer and low-noise amplifier (LNA), and broadband 7.1 GHz and 12.6 GHz Darlington amplifiers from this family of circuits are discussed.
Keywords :
MMIC amplifiers; MMIC mixers; asynchronous transfer mode; bipolar MMIC; elemental semiconductors; microwave links; multimedia communication; silicon; wideband amplifiers; 1 to 15 V; 2 dB; 5 to 38 GHz; Al; LNA; SHF; Si; Si bipolar MMICs; bipolar transistors; broadband Darlington amplifiers; broadband multimedia applications; coplanar lines; double-balanced mixer; double-poly Si bipolar technology; implanted-base bipolar technology; inductors; low-noise amplifier; microstrip; polysilicon; three-layer metallization; wireless ATM applications; Bipolar transistors; Circuits; Fabrication; Inductors; Low-noise amplifiers; MMICs; Metallization; Noise figure; Noise measurement; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1997. Digest of Technical Papers. 43rd ISSCC., 1997 IEEE International
Conference_Location :
San Francisco, CA, USA
ISSN :
0193-6530
Print_ISBN :
0-7803-3721-2
Type :
conf
DOI :
10.1109/ISSCC.1997.585436
Filename :
585436
Link To Document :
بازگشت