Automatic detection of spatial signature on wafermaps in a high volume production

Author

Duvivier, Frédéric

Author_Institution

Device & Yield Eng. Dept., STMicroelectron.-Central R&D, Croiles, France

fYear

1999

fDate

36465

Firstpage

61

Lastpage

66

Abstract

In high volume production, it is important to have a fast response time to yield loss mechanisms. This paper presents a way to detect spatial yield loss on wafers. A procedure automatically computes and provides a summary of signatures taking into account all of the processed wafer. This reduces manual manipulation of data, providing a faster response time

Keywords

data mining; electronic engineering computing; fault diagnosis; integrated circuit modelling; integrated circuit testing; integrated circuit yield; process monitoring; production engineering computing; production testing; automatic computation; automatic detection; fast response time; high volume production; process monitoring; random ratio; segmentation technique; spatial signature; spatial yield loss detection; wafermaps; wafers; yield loss mechanisms; Contamination; Delay; Displays; History; Manufacturing processes; Production; Research and development; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Defect and Fault Tolerance in VLSI Systems, 1999. DFT '99. International Symposium on

Conference_Location

Albuquerque, NM

ISSN

1550-5774

Print_ISBN

0-7695-0325-x

Type

conf

DOI

10.1109/DFTVS.1999.802870

Filename

802870