DocumentCode
3472704
Title
Detecting oxide quality problems using JT testing
Author
Crook, D.L.
Author_Institution
Intel Corp., Hillsboro, OR, USA
fYear
1991
fDate
9-11 April 1991
Firstpage
337
Lastpage
341
Abstract
The author demonstrates that JT testing is much more effective in detecting subtle defect problems on advanced thin gate technologies than the traditional ramped voltage tests. A comparison of the traditional ramp voltage tests and JT tests has been made relative to detecting subtle oxide defect problems. It has been found that, due to electron trapping, some types of gate oxide problems cannot be detected by using the JEDEC ramp voltage test, but, they can easily be detected by using the JEDEC JT test. A discussion of why this occurs along with several examples of different gate oxide problems is presented.<>
Keywords
MOS integrated circuits; circuit reliability; electric breakdown of solids; electron traps; integrated circuit testing; quality control; JEDEC; JT testing; electron trapping; oxide failures; thin gate technologies; Breakdown voltage; Contamination; Current density; Degradation; Electric breakdown; Electrodes; Electron traps; Gate leakage; Measurement standards; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1991, 29th Annual Proceedings., International
Conference_Location
Las Vegas, NV, USA
Print_ISBN
0-87942-680-2
Type
conf
DOI
10.1109/RELPHY.1991.146040
Filename
146040
Link To Document