Title :
Detecting oxide quality problems using JT testing
Author_Institution :
Intel Corp., Hillsboro, OR, USA
Abstract :
The author demonstrates that JT testing is much more effective in detecting subtle defect problems on advanced thin gate technologies than the traditional ramped voltage tests. A comparison of the traditional ramp voltage tests and JT tests has been made relative to detecting subtle oxide defect problems. It has been found that, due to electron trapping, some types of gate oxide problems cannot be detected by using the JEDEC ramp voltage test, but, they can easily be detected by using the JEDEC JT test. A discussion of why this occurs along with several examples of different gate oxide problems is presented.<>
Keywords :
MOS integrated circuits; circuit reliability; electric breakdown of solids; electron traps; integrated circuit testing; quality control; JEDEC; JT testing; electron trapping; oxide failures; thin gate technologies; Breakdown voltage; Contamination; Current density; Degradation; Electric breakdown; Electrodes; Electron traps; Gate leakage; Measurement standards; Testing;
Conference_Titel :
Reliability Physics Symposium, 1991, 29th Annual Proceedings., International
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-87942-680-2
DOI :
10.1109/RELPHY.1991.146040