Title :
Advanced interconnect and low cost μ stud BGA
Author :
Mita, Mamoru ; Murakami, Gert ; Kumakura, Toyohiko ; Okabe, Norio ; Shinzawa, S.
Author_Institution :
Densen Works Hitachi Cable, Hitachi City, Japan
Abstract :
The μ stud BGA is designed to reduce the number of interconnects for higher reliability and low cost. The manufacturing processes of conventional lead-frame are applied to make a high pin count package. Numerous studs are laid out around the LSI´s pad area in 0.5 mm pitch for wire bonding. The bottoms of the studs are directly connected to the substrate by micro-soldering. The μ stud BGA has no routine in the encapsulated package body. Only bonding wires and studs are used for interconnection. Because of this, the package style is simpler and smaller than other kinds of high density package. It is a shrunken lead-frame style package. The lead-frame with numerous studs is manufactured by a conventional photochemical etching and electroplating process. The package is molded by a plastic transfer molding machine
Keywords :
electroplating; etching; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; large scale integration; lead bonding; soldering; μ stud BGA; 0.5 mm; LSI; bonding wires; electroplating; interconnects; manufacturing processes; micro-soldering; photochemical etching; pin count; plastic transfer molding machine; reliability; shrunken lead-frame style package; wire bonding; Bonding; Chip scale packaging; Costs; Electronics packaging; Etching; Flip chip; Manufacturing processes; Packaging machines; Photochemistry; Plastic packaging; Resins; Routing; Transfer molding; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526199
