Title :
An overview of manufacturing BGA technology
Author :
Mearig, Joel ; Goers, Bill
Author_Institution :
Electron. Manuf. Productivity Facility, USA
Abstract :
Ball Grid Array (BGA) technology is one ofthe leading edge technologies in surface mount manufacturing. The driving force behind the advancement of BGA technology is the lead spacing of standard surface mount devices. As lead pitches drop below 20 mil, manufacturing becomes exponentially more difficult. BGA technology provides the same I/O count in the same body size with a significant increase in pitch. Manufacturing BGAs is comparable to standard surface mount device manufacturing. Standard equipment for paste application, placement, reflow and cleaning will work with first generation BGAs. The paper discusses BGA manufacturing using 20 mil SMT manufacturing as a baseline
Keywords :
fine-pitch technology; printed circuit manufacture; reflow soldering; surface cleaning; surface mount technology; 20 mil; BGA manufacturing; BGA technology; SMT manufacturing; ball grid array technology; cleaning; lead pitch; paste application; placement; reflow; surface mount manufacturing; Apertures; Cleaning; Electronic equipment manufacture; Electronics packaging; Lead; Machine vision; Manufacturing processes; Printed circuits; Printing; Productivity; Pulp manufacturing; Surface-mount technology;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-2996-1
DOI :
10.1109/IEMT.1995.526200
