An overview of manufacturing BGA technology

Author

Mearig, Joel ; Goers, Bill

Author_Institution

Electron. Manuf. Productivity Facility, USA

fYear

1995

fDate

2-4 Oct 1995

Firstpage

434

Lastpage

437

Abstract

Ball Grid Array (BGA) technology is one ofthe leading edge technologies in surface mount manufacturing. The driving force behind the advancement of BGA technology is the lead spacing of standard surface mount devices. As lead pitches drop below 20 mil, manufacturing becomes exponentially more difficult. BGA technology provides the same I/O count in the same body size with a significant increase in pitch. Manufacturing BGAs is comparable to standard surface mount device manufacturing. Standard equipment for paste application, placement, reflow and cleaning will work with first generation BGAs. The paper discusses BGA manufacturing using 20 mil SMT manufacturing as a baseline

Keywords

fine-pitch technology; printed circuit manufacture; reflow soldering; surface cleaning; surface mount technology; 20 mil; BGA manufacturing; BGA technology; SMT manufacturing; ball grid array technology; cleaning; lead pitch; paste application; placement; reflow; surface mount manufacturing; Apertures; Cleaning; Electronic equipment manufacture; Electronics packaging; Lead; Machine vision; Manufacturing processes; Printed circuits; Printing; Productivity; Pulp manufacturing; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1995. 'Manufacturing Technologies - Present and Future', Seventeenth IEEE/CPMT International

Conference_Location

Austin, TX

Print_ISBN

0-7803-2996-1

Type

conf

DOI

10.1109/IEMT.1995.526200

Filename

526200