DocumentCode :
3473245
Title :
Temperature-aware global placement
Author :
Obermeier, Bernd ; Johannes, Frank M.
Author_Institution :
Inst. of Electron. Design Autom., Tech. Univ. of Munich, Germany
fYear :
2004
fDate :
27-30 Jan. 2004
Firstpage :
143
Lastpage :
148
Abstract :
We describe a deterministic placement method for standard cells which minimizes total power consumption and leads to a smooth temperature distribution over the die. It is based on the quadratic placement formulation, where the overall weighted net length is minimized. Two innovations are introduced to achieve the above goals. First, overall power consumption is minimized by shortening nets with a high power dissipation. Second, cells are spread over the placement area such that the die temperature profile inside the package is flattened. Experimental results show a significant reduction of the maximum temperature on the die and a reduction of total power consumption.
Keywords :
circuit layout CAD; power consumption; temperature distribution; deterministic placement method; power consumption; quadratic placement formulation; smooth temperature distribution; temperature-aware global placement; Capacitance; Circuits; Computational modeling; Electronic design automation and methodology; Energy consumption; Packaging; Power dissipation; Simulated annealing; Temperature distribution; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2004. Proceedings of the ASP-DAC 2004. Asia and South Pacific
Print_ISBN :
0-7803-8175-0
Type :
conf
DOI :
10.1109/ASPDAC.2004.1337555
Filename :
1337555
Link To Document :
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