DocumentCode :
3473393
Title :
29th Annual Proceedings. Reliability Physics 1991 (Cat. No.91CH2974-4)
fYear :
1991
fDate :
9-11 April 1991
Keywords :
ageing; failure analysis; life testing; metallisation; monolithic integrated circuits; packaging; aging; bipolar devices; burn-in; compound semiconductors; dielectrics; fabrication processes; failure analysis; hot carriers; life testing; memory devices; metallization; packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1991, 29th Annual Proceedings., International
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-87942-680-2
Type :
conf
DOI :
10.1109/RELPHY.1991.146043
Filename :
146043
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3473393
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