DocumentCode :
3473975
Title :
Open architecture test system: not why but when!
Author :
Chakradhar, Srimat
Author_Institution :
NEC Laboratories America
fYear :
2004
fDate :
27-30 Jan. 2004
Firstpage :
337
Lastpage :
340
Keywords :
Automatic testing; Chip scale packaging; Consumer electronics; Costs; Electronic equipment manufacture; Electronic equipment testing; Fabrication; Manufacturing; Semiconductor device manufacture; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2004. Proceedings of the ASP-DAC 2004. Asia and South Pacific
Print_ISBN :
0-7803-8175-0
Type :
conf
DOI :
10.1109/ASPDAC.2004.1337594
Filename :
1337594
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3473975
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