Title :
Electrical insulation properties of the polyimide prepared by VDPM
Author :
Park, J.K. ; Kim, H.G. ; Kim, J.T. ; Lee, D.C.
Author_Institution :
Dept. of Inf. & Commun., Yuhan Coll., Kyeongi-do, South Korea
Abstract :
The polyimide thin films, which are synthesized with pyromellitic dianhydride (PMDA) and 4,4´-diaminodiphenyl ether (DDE), are fabricated by the vapor deposition polymerized method of dry processes. In order to analyze the characteristics required for inter-layer insulation films of semiconductor devices, the molecular structure and uniformity, the variation of the internal composition element, the permeation depth of the upper electrode, and the breakdown strength are experimentally investigated
Keywords :
Auger electron spectra; dielectric thin films; electric strength; infrared spectra; integrated circuit metallisation; organic insulating materials; polymer films; polymer structure; polymerisation; vacuum deposition; 4,4´-diaminodiphenyl ether; breakdown strength; dry processes; electrical insulation properties; inter-layer insulation films; internal composition element variation; molecular structure; polyimide thin films; pyromellitic dianhydride; semiconductor devices; uniformity; upper electrode permeation depth; vapor deposition polymerized method; Chemical vapor deposition; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Polyimides; Polymer films; Semiconductor devices; Semiconductor films; Semiconductor thin films; Sputtering;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1999 Annual Report Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-5414-1
DOI :
10.1109/CEIDP.1999.804644
