Research progress on Physics-of-Failure based fatigue stress-damage model of solder joints in electronic packing

Physics-of-failure (POF) prognostic model is a key technique of prognostics and health management (PHM) which plays critical roles for remaining life assessment of the products. The recent developments in POF based stress-damage model on thermal fatigue and vibration fatigue of solder joints were summarized. Numerous fatigue stress-damage models were proposed such as stress-fatigue model, strain-fatigue model, fatigue models based on fracture mechanics, energy model and fatigue model based on damage mechanics. At last, problems on research of fatigue stress-damage models were summarized, and some suggestions for future investigations were also made.