• DocumentCode
    3474398
  • Title

    A GCPW to waveguide transition in 60GHz LTCC SiP

  • Author

    Lee, Jae Jin ; Jung, Dong Yun ; Eun, Ki Chan ; Cho, Seong Jun ; Kim, Hong Yi ; Song, In Sang ; Byeon, Chul Woo ; Oh, Inn-Yeal ; Bang, Jai-Hoon ; Park, Chul Soon

  • Author_Institution
    Intell. Radio Eng. Center, Inf. & Commun. Univ., Daejeon
  • fYear
    2009
  • fDate
    18-22 Jan. 2009
  • Firstpage
    466
  • Lastpage
    469
  • Abstract
    This paper proposes a low loss and broadband grounded coplanar waveguide (GCPW) to waveguide (WG) transition in a low temperature co-fired ceramic (LTCC) multi-layer structure for 60 GHz applications. The GCPW and WG are fully integrated on the same substrate, and the ground wall of the embedded WG is made up of a staggered via fence. A 3lambda/4 bent short stub is connected between signal line of GCPW and WG ground wall for effective coupling. The WG dimension is gradually increased for broadband characteristic. Measured results for a single transition show that the insertion loss is 0.775 dB at 58.3 GHz and the 3-dB bandwidth is 6.8 GHz from 53.1GHz to 59.9 GHz. The proposed transition structure has been packaged in 60 GHz LTCC System-in-Package(SiP) receiver module, and a 60 GHz wireless data link at 648 Mbps over 3 m has been demonstrated.
  • Keywords
    MMIC; ceramics; coplanar waveguides; multichip modules; system-in-package; waveguide transitions; LTCC system-in-package receiver module; bandwidth 6.8 GHz; bit rate 648 Mbit/s; frequency 58.3 GHz; frequency 60 GHz; grounded coplanar waveguide; insertion loss; loss 0.775 dB; low temperature co-fired ceramic multilayer structure; waveguide transition; wireless data link; Bandwidth; Broadband antennas; Coplanar waveguides; Horn antennas; Insertion loss; MMICs; Magnetic fields; Microwave antennas; Stripline; Waveguide transitions; 60GHz; LTCC; SiP; Transition; V-band; grounded coplanar waveguide; waveguide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio and Wireless Symposium, 2009. RWS '09. IEEE
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4244-2698-0
  • Electronic_ISBN
    978-1-4244-2699-7
  • Type

    conf

  • DOI
    10.1109/RWS.2009.4957389
  • Filename
    4957389