Title :
System-in-Package solutions for WiMAX applications based on LTCC technology
Author :
Yatsenko, Andriy ; Wong, Wai San ; Heyen, Johann ; Nalezinski, Martin ; Sevskiy, Georgiy ; Vossiek, Martin ; Heide, Patric
Author_Institution :
SAW Div., EPCOS AG, Munich
Abstract :
This paper presents a dual-band (2 and 3 GHz) and a single-band (2 GHz) highly-integrated WiMAX System-in-Package module based on LTCC (Low Temperature Cofired Ceramics). They comprise of complete passive and active RF frontend plus the RFIC for up- and down-conversion to the base band. Both modules support 1times2 (1 transmit, 2 receive paths) MIMO operability. The top level measurements of the SiPs show full performance and thus fully validate the LTCC integration approach.
Keywords :
MIMO communication; MMIC frequency convertors; WiMax; ceramic packaging; integrated circuit packaging; mobile radio; radiofrequency integrated circuits; LTCC technology; MIMO operability; RFIC; down-conversion; frequency 2 GHz; frequency 3 GHz; low temperature cofired ceramics; mobile WiMAX; single-band highly-integrated WiMAX system-in-package module; up-conversion; WiMAX; LTCC; MIMO SiP; WiMAX; balanced filter; diplexer;
Conference_Titel :
Radio and Wireless Symposium, 2009. RWS '09. IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-2698-0
Electronic_ISBN :
978-1-4244-2699-7
DOI :
10.1109/RWS.2009.4957390
