2.5D system integration: a design driven system implementation schema

Author

Deng, Yangdong Steven ; Maly, Wojciech

Author_Institution

Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA

fYear

2004

fDate

27-30 Jan. 2004

Firstpage

450

Lastpage

455

Abstract

We investigate a 3D die-stacking based VLSI integration strategy, socalled 2.5D integration, which can potentially overcome many problems stumbling the development of monolithic system-on-chip (SoC). Here, we review available fabrication technologies and testing solutions for the new integration strategy. We also propose a design driven system implementation schema for this new integration strategy. A layout synthesis framework is under development by us to analyze typical "what if" questions and resolve major physical attributes for a 2.5D system according to the design specification and constraints.

Keywords

VLSI; circuit layout CAD; integrated circuit design; system-on-chip; 2.5D system integration; 3D die-stacking; VLSI integration; design driven system implementation schema; fabrication technology; layout synthesis framework; monolithic system-on-chip; CMOS technology; Costs; Delay; Fabrication; Integrated circuit interconnections; Logic design; Microprocessors; Random access memory; System-on-a-chip; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference, 2004. Proceedings of the ASP-DAC 2004. Asia and South Pacific

Print_ISBN

0-7803-8175-0

Type

conf

DOI

10.1109/ASPDAC.2004.1337617

Filename

1337617