Title :
A Wafer-level Protective Technique Using Glass Caps for MEMS Gyroscopes
Author :
Ding, Haitao ; Yang, Zhenchuan ; Chen, Zhiyong ; Zhang, Rong ; Yan, Guizhen
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing
Abstract :
MEMS gyroscopes are easily damaged and contaminated in dicing, test, transportation and storage due to their fragile movable structures and small feature size. A wafer-level protective technique is developed by directly bonding a glass cap on the fabricated gyroscope. The protective packaging is based on the silicon glass anodic-bonding and deep etching release (SGADER) process. Preliminary testing is carried out to study the reliability and yield of the protective packaging technique, and the results show that a great improvement has been achieved
Keywords :
etching; glass; gyroscopes; micromechanical devices; wafer level packaging; MEMS gyroscopes; anodic bonding; deep etching release; glass caps; protective packaging; wafer level packaging; Glass; Gyroscopes; Micromechanical devices; Packaging; Protection; Silicon; Testing; Transportation; Wafer bonding; Wafer scale integration;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
DOI :
10.1109/ICSICT.2006.306637
