DocumentCode :
3474465
Title :
The Failure Mechanism of Gate Resistance Testing for Power MOSFET
Author :
Pan, Shaohui ; He, Lunwen ; Zhang, David Wei ; Wang, LK
Author_Institution :
Dept. of Microelectron., Fudan Univ., Shanghai
fYear :
2006
fDate :
23-26 Oct. 2006
Firstpage :
2132
Lastpage :
2134
Abstract :
The vertical DMOS (double diffused MOSFET) is widely used in power microelectronics, its switching performance is determined mainly by the gate resistance and the input capacitance. Thus a gate resistance testing technique is developed in order to determine its device functionality. In this paper the authors discuss various processes induced device failures, such as the poor interconnect of the poly gate and the metal, the bonding wire, and the etch process, and their impact to the performance and reliability of the devices as well as the in-line testing method used for the performance validation
Keywords :
power MOSFET; semiconductor device reliability; semiconductor device testing; bonding wire; device failures; double diffused MOSFET; gate resistance testing; in-line testing; performance validation; power MOSFET; power microelectronics; Capacitance; Electric resistance; Failure analysis; Immune system; MOSFET circuits; Microelectronics; Power MOSFET; Power dissipation; Testing; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306638
Filename :
4098647
Link To Document :
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