• DocumentCode
    3474572
  • Title

    A fully-integrated linearized CMOS distributed amplifier based on Multi-Tanh principle for radio over fiber and ultra-wideband applications

  • Author

    El-Khatib, Ziad ; MacEachern, Leonard ; Mahmoud, Samy A.

  • Author_Institution
    Dept. of Electron. & CPFR, Carleton Univ., Ottawa, ON
  • fYear
    2009
  • fDate
    18-22 Jan. 2009
  • Firstpage
    506
  • Lastpage
    509
  • Abstract
    The design of a linearized fully-integrated CMOS distributed amplifier with broadband distortion cancellation capability for ultra-wideband applications is presented. Measured linearized CMOS DA results showed that by reducing the IMD3 products of the linearized DA improves the IIP3 DA linearity which can lead to 5 dB improvement in the linearized DA C/IM3 power ratio. The linearized CMOS DA provides 7 dB measured peak power gain and rolls off to unity gain bandwidth of 8 GHz. The linearized CMOS DA attains better than -23 dB of reverse isolation, while requiring no off-chip components. Measured S11 and S22 are better than -10 dB over the entire bandwidth up to 10 GHz.
  • Keywords
    CMOS integrated circuits; distortion; distributed amplifiers; radio-over-fibre; radiofrequency amplifiers; ultra wideband communication; Multi-Tanh principle; bandwidth 8 GHz; broadband distortion cancellation capability; fully-integrated linearized CMOS distributed amplifier; peak power gain; radio over fiber; ultra-wideband applications; unity gain bandwidth; Bandwidth; Circuits; Distortion measurement; Distributed amplifiers; Frequency; Intermodulation distortion; Linearization techniques; Power measurement; Ultra wideband technology; Voltage; CMOS Distributed Amplifier; Carrier power to IMD3 power ratio (C/IM3) Improvement; Multi-Tanh Linearization Techniques; Radio over Fiber; Third-Order Intermodulation Distortion Cancellation; Ultra WideBand Communications; Volterra Series;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio and Wireless Symposium, 2009. RWS '09. IEEE
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4244-2698-0
  • Electronic_ISBN
    978-1-4244-2699-7
  • Type

    conf

  • DOI
    10.1109/RWS.2009.4957399
  • Filename
    4957399