DocumentCode :
3474805
Title :
Characterization of Sputtered Ta and TaN Films by Spectroscopic Ellipsometry
Author :
Waechtler, Thomas ; Gruska, Bernd ; Zimmermann, Sven ; Schulz, Stefan E. ; Gessner, Thomas
Author_Institution :
Center for Microtechnologies - ZfM, Chemnitz Univ. of Technol.
fYear :
2006
fDate :
23-26 Oct. 2006
Firstpage :
2184
Lastpage :
2186
Abstract :
Spectroscopic ellipsometry is emerging as a routine tool for in-situ and ex-situ thin-film characterization in semiconductor manufacturing. For interconnects in ULSI circuits, diffusion barriers of below 10 nm thickness are required and precise thickness control of the deposited layers is indispensable. In this work, we studied single films of tantalum and two stoichiometrics of tantalum nitride as well as TaN/Ta film stacks both on bare and oxidized silicon. Spectroscopic ellipsometry from the UV to the NIR was applied to determine the optical properties of the films for subsequent modeling by a Lorentz-Drude approach. These models were successfully applied to TaN/Ta thin-film stacks where the values of the film thickness could be determined exactly. Moreover, it is shown that considerable differences in the optical properties arise from both film thickness and substrate
Keywords :
ULSI; diffusion barriers; ellipsometry; integrated circuit interconnections; integrated circuit manufacture; optical properties; semiconductor thin films; tantalum; tantalum compounds; Lorentz-Drude approach; TaN-Ta; ULSI circuits interconnects; diffusion barriers; film stacks; film thickness; optical properties; semiconductor manufacturing; spectroscopic ellipsometry; sputtered films; thin-film characterization; Ellipsometry; Integrated circuit interconnections; Optical films; Semiconductor device manufacture; Semiconductor films; Semiconductor thin films; Spectroscopy; Sputtering; Thin film circuits; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 2006. ICSICT '06. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0160-7
Electronic_ISBN :
1-4244-0161-5
Type :
conf
DOI :
10.1109/ICSICT.2006.306675
Filename :
4098662
Link To Document :
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