DocumentCode :
3475090
Title :
On the impact of the NBTI recovery phenomenon on lifetime prediction of modern p-MOSFETs
Author :
Schlunder, Christian ; Heinrigs, Wolfgang ; Gustin, Wolfgang ; Reisinger, Hans
Author_Institution :
Dept. of Central Reliability, Infineon Technol. AG, Munich
fYear :
2006
fDate :
Oct. 16 2006-Sept. 19 2006
Firstpage :
1
Lastpage :
4
Abstract :
The NBTI recovery phenomenon leads to a fast reduction of the stress induced electrical device parameter degradation after end of stress. Delay times between device-stress and -characterization within NBTI-experiments affect the measurement values of degradation. This work discusses the impact of these delays on lifetime prediction for technology qualifications. For this reason we investigate delay times from 1mus up to 60s and stress times from 100ms up to 250000s. A correlation between stress time, delay time induced recovery and error in predicted lifetime is elaborated for the first time. Furthermore we give simple guidelines for measurement requirements and essential stress times for accurate lifetime evaluations
Keywords :
MOSFET; delay estimation; semiconductor device reliability; stress measurement; thermal stability; NBTI recovery phenomenon; delay times; lifetime prediction; modern p-MOSFET; stress induced electrical device parameter degradation; stress times; CMOS technology; Degradation; Delay effects; MOSFET circuits; Niobium compounds; Operational amplifiers; Performance evaluation; Stress measurement; Threshold voltage; Titanium compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2006 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
1-4244-0296-4
Electronic_ISBN :
1930-8841
Type :
conf
DOI :
10.1109/IRWS.2006.305199
Filename :
4098676
Link To Document :
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