DocumentCode
3475328
Title
Ultra-Fast Measurements of VTH Instability in SiC MOSFETs due to Positive and Negative Constant Bias Stress
Author
Gurfinkel, M. ; Suehle, J. ; Bernstein, J.B. ; Shapira, Y. ; Lelis, A.J. ; Habersat, D. ; Goldsman, N.
Author_Institution
Maryland Univ., College Park, MD
fYear
2006
fDate
Oct. 16 2006-Sept. 19 2006
Firstpage
49
Lastpage
53
Abstract
One of the most important issues that limits the performance and reliability of SiC power MOSFETs is the threshold voltage instability under normal operation conditions. This phenomenon has been recently studied using dc sweep measurements. In this work, we studied the threshold voltage instability using fast I-V measurements. The results show that under positive bias, VTH shifts to more positive values, while it shifts to more negative values under negative bias. Fast I-V measurements reveal the full extent of the VTH instability, underestimated by the dc measurements. Furthermore, fast measurements allow the separation of negative and positive bias stress effects. A physical model involving fast transient charge trapping and de-trapping at and near the SiC/SiO2 interface is proposed
Keywords
power MOSFET; semiconductor device reliability; voltage measurement; dc measurements; fast measurements; fast transient charge trapping; negative constant bias stress; positive constant bias stress; power MOSFET; threshold voltage instability; Educational institutions; Laboratories; MOSFETs; NIST; Pulse measurements; Silicon carbide; Stress measurement; Thermal conductivity; Thermal stresses; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2006 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
1-4244-0296-4
Electronic_ISBN
1930-8841
Type
conf
DOI
10.1109/IRWS.2006.305209
Filename
4098686
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