• DocumentCode
    3475385
  • Title

    Integrating buffer planning with floorplanning for simultaneous multi-objective optimization

  • Author

    Yi-Hui Cheng ; Yao-Wen Chang

  • Author_Institution
    Synopsys Inc.
  • fYear
    2004
  • fDate
    27-30 Jan. 2004
  • Firstpage
    624
  • Lastpage
    627
  • Abstract
    As the process technology advances into the deep submicron era, interconnect plays a dominant role in determining circuit performance and signal integrity. Buffer insertion is one of the most effective and popular techniques to reduce interconnnect delay and decouple coupling effects. It is traditionally applied to post-layout optimization. However, it is obviously infeasible to insert hundreds of thousands buffers during the post-layout starge when most routing regions are occupied. Therefore, it is desirable to incorporate buffer planning into floor-planning to ensure thiming closure and design convergence. In this paper, we drive the formulae of feasible regions, and integrate buffer planning with floor-planning to optimize area, timing, noise, and congestion (routability) simultaneously. In particular, we treat each buffer block as a soft module and apply Lagragian relaxation to optimize the floorplan area. Experimental results show that our method obtains an average suceess rate of 94.9% (86.4%) of nets meeting timimg constraint alone (both timing and noise constraints)and consumes an average extra area of only 0.1% (0.2%) over the given floorplan.
  • Keywords
    Capacitance; Circuit noise; Coupling circuits; Crosstalk; Delay effects; Integrated circuit interconnections; Noise figure; Routing; Timing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2004. Proceedings of the ASP-DAC 2004. Asia and South Pacific
  • Conference_Location
    Yohohama, Japan
  • Print_ISBN
    0-7803-8175-0
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2004.1337667
  • Filename
    1337667