DocumentCode :
3475440
Title :
Device variability and reliability check for ultra-thin-body and bulk oxide CMOSFETs
Author :
Wen-Kuan Yeh ; Chun-Ming Lai ; Li-Kong Chin ; Po-Ying Chen
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
fYear :
2013
fDate :
3-5 June 2013
Firstpage :
1
Lastpage :
2
Abstract :
In this work, we investigate the impact of substrate doping concentration on device characteristic variation and sensitivity to substrate bias for ultra-thin body and bulk oxide SOI MOSFET. We found that high substrate dose device suffer from unsymmetrical and variance in device´s characteristics. Compared to high dose substrate UTBB-SOI device, low dose substrate device characteristic is less sensitive to substrate back bias. And we found that low substrate dose SOI device which with lower impact ionization shows better device´s reliability than the high substrate dose one does.
Keywords :
MOSFET; elemental semiconductors; impact ionisation; semiconductor device reliability; semiconductor doping; silicon-on-insulator; bulk oxide SOI CMOSFET; device characteristic variation; device characteristics; device variability; high-dose substrate UTBB-SOI device; high-substrate dose device; impact ionization; low-dose substrate device characteristic; low-substrate dose SOI device; reliability check; substrate back bias; substrate bias; substrate doping concentration; ultrathin-body SOI CMOSFET; Degradation; Hot carriers; MOSFET; MOSFET circuits; Substrates; STRESSING; UTBB-SOI; VARIANCE;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
Conference_Location :
Hong Kong
Type :
conf
DOI :
10.1109/EDSSC.2013.6628081
Filename :
6628081
Link To Document :
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