DocumentCode :
3475804
Title :
Oxide Reliability: a new Methodology for Reliability Evaluation at Parametric Testing
Author :
Bottini, R. ; Sebastiani, A. ; Galbiati, N. ; Scozzari, C. ; Ghidini, G.
Author_Institution :
FTM Adv. R&D, STMicroelectron., Agrate Brianza
fYear :
2006
fDate :
Oct. 16 2006-Sept. 19 2006
Firstpage :
142
Lastpage :
145
Abstract :
Aim of this work is to propose a new fast methodology to be applied to thick gate and tunnel oxides in Flash and embedded Flash processes. Starting from the reliability characterization of the dielectric it is possible to define a very short stress (lower than 1-2sec) which correlates with standard long reliability testing procedures (constant voltage stress, CVS, or constant current stress, CCS). For thick dielectrics, whose significant charge trapping affects the lifetime, the definition of a short stress condition is critical, but it is shown that a short CCS test can overcome this problem. This short test can be introduced at parametric testing in order to screen defective oxides following a criteria directly correlated with device requirements
Keywords :
dielectric materials; flash memories; life testing; reliability; charge trapping; constant current stress; constant voltage stress; dielectric materials; embedded Flash process; long reliability testing procedures; oxide reliability; parametric testing; reliability characterization; reliability evaluation; thick gate dielectrics; tunnel oxides; very short stress; Acceleration; Carbon capture and storage; Condition monitoring; Current density; Dielectrics; Life estimation; Life testing; Research and development; Stress; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2006 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
1-4244-0296-4
Electronic_ISBN :
1930-8841
Type :
conf
DOI :
10.1109/IRWS.2006.305230
Filename :
4098707
Link To Document :
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