DocumentCode :
3475969
Title :
Nickel germanide with rare earth interlayers for Ge CMOS applications
Author :
Mishra, R.K. ; Ganguly, Utsav ; Ganguly, Shaumik ; Lodha, Saurabh ; Nainani, Aneesh ; Abraham, Matthew C.
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol.(IIT), Mumbai, India
fYear :
2013
fDate :
3-5 June 2013
Firstpage :
1
Lastpage :
2
Abstract :
In this study we show that incorporation of rare earth metal interlayers such as Yb and Er between Ni and n-Ge can simultaneously enhance the stability of the germanide as well as lower the Schottky barrier (φb) at the germanide/n-Ge interface. As compared to nickel germanide, thermal stability improvement in the low resistance phase by nearly 150 °C and reduction in the electron Schottky barrier height by 0.13 eV was observed for germanides formed using Yb and Er interlayers. This work addresses key challenges in realizing low resistance contacts to n-Ge for future logic and memory applications.
Keywords :
CMOS integrated circuits; erbium; germanium; nickel; thermal stability; ytterbium; CMOS applications; Er; Ge; Ni; Yb; electron Schottky barrier height reduction; logic applications; low resistance contacts; low resistance phase; memory applications; nickel germanide; rare earth interlayers; thermal stability improvement; Erbium; Germanium; Tiles; Fermi level pinning; Germanide; Rare earth metals; Schottky barrier; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
Conference_Location :
Hong Kong
Type :
conf
DOI :
10.1109/EDSSC.2013.6628107
Filename :
6628107
Link To Document :
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