Title :
A novel package-on-package stacking technique
Author :
Xiaofeng Sun ; Maoyun Pan ; Yuan Lu ; Lixi Wan
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
In this paper a four-layer package-on-package(PoP) stacking structure was introduced which allowed the whole package using fine pitch solder ball and consequently improved the interconnection I/O density between the neighboring packages.
Keywords :
ball grid arrays; fine-pitch technology; integrated circuit interconnections; integrated circuit packaging; solders; fine pitch solder ball; four-layer PoP stacking structure; four-layer package-on-package stacking structure; interconnection I-O density; neighboring packages; Cavity resonators; Electronics packaging; Fabrication; Heating; Packaging; Stacking; Substrates; 3D package; PoP; high density package; organic substrate;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756415
