DocumentCode
347650
Title
Fault modeling of suspended thermal MEMS
Author
Charlot, B. ; Mir, S. ; Cota, E.F. ; Lubaszewski, M. ; Courtois, B.
Author_Institution
TIMA Lab., Grenoble, France
fYear
1999
fDate
1999
Firstpage
319
Lastpage
328
Abstract
As next generation chips embedding MEMS appear, fault-based and defect-oriented tests for MEMS parts become important for cost-effective production testing. This paper presents realistic fault modeling and simulation techniques for suspended thermal MEMS, an already successful domain of application
Keywords
equivalent circuits; fault simulation; finite element analysis; micromachining; micromechanical devices; production testing; semiconductor device models; semiconductor device testing; CMOS compatible bulk micromachining; FEM modelling; analog HDL; cost-effective production testing; defect-oriented tests; electrothermal convertor; equivalent electrical model; fault injection; fault modeling; fault simulation; fault-based tests; micromachining defects; next generation chips embedding MEMS; simulation techniques; suspended thermal MEMS; thermal short; Circuit faults; Circuit testing; Costs; Manufacturing; Microelectronics; Micromachining; Micromechanical devices; Packaging; Production; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1999. Proceedings. International
Conference_Location
Atlantic City, NJ
ISSN
1089-3539
Print_ISBN
0-7803-5753-1
Type
conf
DOI
10.1109/TEST.1999.805646
Filename
805646
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