DocumentCode
347668
Title
Modeling the probability of defect excitation for a commercial IC with implications for stuck-at fault-based ATPG strategies
Author
Dworak, Jennifer ; Grimaila, Michael R. ; Lee, Sooryong ; Wang, Li.-C. ; Mercer, M. Ray
Author_Institution
Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
fYear
1999
fDate
1999
Firstpage
1031
Lastpage
1037
Abstract
If many potential defects exist at each site in an integrated circuit, then as the number of applied test patterns increases, the number of defects which remain undetected decreases monotonically. Modeling this rate of decline in defective part level is a non-trivial problem. We show that the number of times each site is observed serves as a significantly superior basis for modeling this phenomenon when contrasted with the number of faults detected. This “site observation-based” predictor not only increases the accuracy of defective part level prediction, it also provides the first quantitative method for comparing the effectiveness of various ATPG strategies to reduce the defective part level
Keywords
automatic test pattern generation; fault simulation; integrated circuit testing; integrated circuit yield; logic testing; probability; production testing; commercial IC; defective part level model; defective part level prediction; fault coverage; manufacture testing; probability of defect excitation; site observation-based predictor; stuck-at fault-based ATPG; yield; Automatic test pattern generation; Circuit faults; Circuit testing; Digital integrated circuits; Fault detection; Integrated circuit modeling; Integrated circuit yield; Manufacturing processes; Pattern analysis; Probability;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1999. Proceedings. International
Conference_Location
Atlantic City, NJ
ISSN
1089-3539
Print_ISBN
0-7803-5753-1
Type
conf
DOI
10.1109/TEST.1999.805836
Filename
805836
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