• DocumentCode
    3476710
  • Title

    Transient fault models and AVF estimation revisited

  • Author

    George, Nishant J. ; Elks, Carl R. ; Johnson, Barry W. ; Lach, John

  • Author_Institution
    Charles L. Brown Dept. of Electr. & Comput. Eng., Univ. of Virginia, Charlottesville, VA, USA
  • fYear
    2010
  • fDate
    June 28 2010-July 1 2010
  • Firstpage
    477
  • Lastpage
    486
  • Abstract
    Transient faults (also known as soft-errors) resulting from high-energy particle strikes on silicon are typically modeled as single bit-flips in memory arrays. Most Architectural Vulnerability Factor (AVF) analyses assume this model. However, accelerated radiation tests on static random access memory (SRAM) arrays built using modern technologies show evidence of clustered upsets resulting from single particle strikes. In this paper, these observations are used to define a scalable fault model capable of representing fault multiplicities. Applying this model, a probabilistic framework for incorporating vulnerability of SRAM arrays to different fault multiplicities into AVF is proposed. An experimental fault injection setup using a detailed microarchitecture simulation running generic benchmarks was used to demonstrate vulnerability characterization in light of the new fault model. Further, rigorous fault injection is used to demonstrate that conventional methods of AVF estimation overestimate vulnerability up to 7× for some structures.
  • Keywords
    SRAM chips; fault tolerant computing; probability; AVF estimation; architectural vulnerability factor; high-energy particle strikes; microarchitecture simulation; silicon; static random access memory; transient fault models; Argon; Circuit faults; Computer errors; Fault tolerance; Life estimation; Radio access networks; Random access memory; Silicon; State estimation; Testing; ACE analysis; AVF; SEU; fault injection; spatial multi-bit upset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dependable Systems and Networks (DSN), 2010 IEEE/IFIP International Conference on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4244-7500-1
  • Electronic_ISBN
    978-1-4244-7499-8
  • Type

    conf

  • DOI
    10.1109/DSN.2010.5544276
  • Filename
    5544276