A kind of 3D hybrid assembly structure and technology

In order to achieve more functions in certain size of the chip, and avoid RC delay caused by long-range interconnect under high density 2D encapsulation at the same time, the researchers focused on the Z direction - 3D packaging. With the increase of storage capacity, and the large scale of data logic fever problems will more and more obvious. So it will not be able to an unlimited number of laminated chips. Many established corporations in the world has developed 3D package. This paper introduces a kind of 3D hybrid assembly structure and technology. 3D hybrid assembly technology can realized a high level of integration and systematization, and the requirement for the thickness of chips is not high. Besides the five substrates are respectively bonded with the five metal surface of the metal shell, it is advantageous to the heat conduction and dissipation. It improves the heat dissipation problems, so it´s better to the common stack type 3D encapsulation.