DocumentCode :
3476755
Title :
Charge control modeling during transient behavior of PT-IGBT using PSpice macromodel
Author :
Raciti, A. ; Torrisi, S. ; Frisina, F. ; Letor, R.
Author_Institution :
Dept. of Electr. Electron. & Syst. Eng., Catania Univ., Italy
Volume :
2
fYear :
1998
fDate :
17-22 May 1998
Firstpage :
1704
Abstract :
A new PSpice model of punch-through (PT) IGBTs is developed to account for the presence of the buffer layer and its influence on the dynamic behavior of the device. The recombination and redistribution of charge in the base region of IGBTs during a transient behavior are modeled and represented by equivalent electric circuits. In particular, the effect of the external voltage (clamping voltage) on the tail current decay is modeled. Besides, phenomena such as the “tail bump” and the variation of the slope in the initial part of the output voltage Vce during a turn-off transient are modeled. The proposed model is validated by comparing several simulation runs to the experimental traces at different static and dynamic working conditions
Keywords :
SPICE; equivalent circuits; insulated gate bipolar transistors; semiconductor device models; transient analysis; PSpice macromodel; buffer layer; charge control modeling; charge recombination; charge redistribution; clamping voltage; dynamic behavior; dynamic working conditions; equivalent electric circuits; external voltage; output voltage; punch-through IGBT; static working conditions; tail bump; tail current decay; transient behavior; turn-off transient; Buffer layers; Circuits; Clamps; Electronic mail; Employee welfare; Insulated gate bipolar transistors; Modeling; SPICE; Tail; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Specialists Conference, 1998. PESC 98 Record. 29th Annual IEEE
Conference_Location :
Fukuoka
ISSN :
0275-9306
Print_ISBN :
0-7803-4489-8
Type :
conf
DOI :
10.1109/PESC.1998.703410
Filename :
703410
Link To Document :
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