Title :
Influence of package failure on IC´s reliability
Author :
Lin Xiao-ling ; Lian Jian-wen ; Zhu Liang-biao
Author_Institution :
Sci. & Technol. on Reliability Phys. & Applic. of Electr. Component Lab., China Electron. Product Reliability & Environ. Testing Res. Inst., Guangzhou, China
Abstract :
Different packaging materials and packaging forms have different influence on the reliability of devices. For the semiconductor device, failure mode caused by wire bond is up to nearly 49%. Therefore, understanding of the structure characteristics of various packaging and their main failure modes and mechanism has important meaning to improve the reliability of devices being used. In this paper, three kinds of common failure modes and failure mechanism of packaged devices are analyzed. Also, some precautions for reducing such failures are presented.
Keywords :
failure analysis; integrated circuit packaging; integrated circuit reliability; lead bonding; IC reliability; failure mode; package failure; packaging forms; packaging materials; semiconductor device; wire bond; Compounds; Delamination; Gold; Plastics; Reliability; Stress; coefficient thermal expansion (CTE); delamination; failure analysis; plastic encapsulated microcircuits (PEMs); reliability;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756435
