• DocumentCode
    3477000
  • Title

    Recent development of surface integral equation solvers for multiscale interconnects and circuits

  • Author

    Sheng Sun ; Lijun Jiang ; Weng Cho Chew

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
  • fYear
    2013
  • fDate
    3-5 June 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    This paper presents a brief review and recent development of surface integral equation solvers for multiscale interconnects and circuits modeling. As the future production processes down to 5 nm and the operating frequency increases, both multi-scale and large-scale natures should be taken into account in the electromagnetic simulations. Fast, efficient, stable, and broadband integral equation based solvers become indispensable when millions or ten s of millions of unknowns might be involved in the simulation of the integrated circuit. Recent progress and our latest researches in the development of broadband fast electromagnetic solvers will be demonstrated.
  • Keywords
    computational electromagnetics; integral equations; interconnections; network analysis; circuit modeling; computational electromagnetics; electromagnetic simulations; multiscale circuits; multiscale interconnects; surface integral equation solvers; Antennas; circuit modeling; computational electromagnetics; integral equation; interconnects; multiscale;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
  • Conference_Location
    Hong Kong
  • Type

    conf

  • DOI
    10.1109/EDSSC.2013.6628158
  • Filename
    6628158