DocumentCode :
3477005
Title :
Planarization of Passivation Layers during Manufacturing Processes of Image Sensors
Author :
Sheikholeslami, Alireza ; Selberherr, Siegfried ; Parhami, Farnaz ; Puchner, Helmut
Author_Institution :
Inst. for Microelectron., Wien
fYear :
2006
fDate :
Sept. 2006
Firstpage :
35
Lastpage :
36
Abstract :
Image sensor processes are sensitive to passivation planarization which prevents clear layer coating issues and shortens the optical path between color filter and active surface. We present analysis of the deposition of passivation layers into trenches of image sensors. The simulation results are obtained by using the topography simulator ELSA (Enhanced Level Set Applications). We predict a range of trench width, stack height, and the thickness of the deposited layers leading to a sufficient planarization margin
Keywords :
image sensors; manufacturing processes; optical films; optical filters; passivation; planarisation; ELSA; active surface; clear layer coating; color filter; enhanced level set application; image sensors; manufacturing process; optical path; passivation layer deposition; planarization; topography simulator; Active filters; Coatings; Color; Image sensors; Manufacturing processes; Optical filters; Optical sensors; Passivation; Planarization; Surface topography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Numerical Simulation of Semiconductor Optoelectronic Devices, 2006. NUSOD '06. International Conference on
Conference_Location :
Nanyang Technological University, Nanyang Executive Centre, Singapore, China
Print_ISBN :
0-7803-9755-X
Type :
conf
DOI :
10.1109/NUSOD.2006.306728
Filename :
4098768
Link To Document :
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