DocumentCode
347701
Title
A new packaging technique for power multichip modules
Author
Gillot, C. ; Henry, D. ; Schaeffer, C. ; Massit, C.
Author_Institution
Lab. d´´Electrotech. de Grenoble, CNRS, St. Martin d´´Heres, France
Volume
3
fYear
1999
fDate
1999
Firstpage
1765
Abstract
A new packaging technique for power multichip modules has been developed. The components are sandwiched between two DBC (direct bond copper) substrates with aluminum nitride. This innovative technique allows to replace wire bond with flip chip and to cool the module on both sides. Thus, electrical, thermal and reliability performance can be improved
Keywords
cooling; integrated circuit packaging; integrated circuit reliability; multichip modules; power integrated circuits; substrates; AlN; direct bond copper substrates; electrical performance; flip chip; module cooling; packaging technique; power multichip modules; reliability performance; thermal performance; Bonding; Copper; Heat sinks; Heat transfer; Multichip modules; Packaging; Substrates; Thermal conductivity; Thermal resistance; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Conference, 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE
Conference_Location
Phoenix, AZ
ISSN
0197-2618
Print_ISBN
0-7803-5589-X
Type
conf
DOI
10.1109/IAS.1999.805978
Filename
805978
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