Shock resistant and thermally reliable low Ag SAC solder doped with Mn

Author

Goudarzi, Visda ; Brown, Michael ; Weiping Liu ; Ning-Cheng Lee ; Lee, Jong Chul

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

182

Lastpage

192

Abstract

98.5Sn0.5Ag1Cu0.05Mn (SAC0510M) exhibits a melting behavior similar to SAC105. It is two times better than SAC105 in the dynamic bending test; more than 8 times better in the modified JEDEC drop test; and more than 40-60% better in the -55°C/125°C thermal cycling test. The reduced hardness and much thinner and stable IMC layer on Ni are responsible for the superior non-fragility, while the stabilized IMC and microstructure are responsible for the thermal cycling performance. A thinner IMC layer on Ni is more important than reduced hardness in improving non-fragility. The thermal cycling performance of SAC0510M may override SAC305. A high Tg brittle board causes poor drop test results due to pad cratering.

Keywords

ball grid arrays; copper alloys; hardness; manganese alloys; melting; printed circuit manufacture; reliability; silver alloys; solders; testing; tin alloys; SAC0510M; Sn-Ag-Cu-Mn; brittle board; dynamic bending test; hardness reduction; melting behavior; modified JEDEC drop test; pad cratering; shock resistant solder; stable IMC layer; thermal cycling test; thermally reliable solder; Metals; Reliability; Resistance; Soldering; Strain; Testing; BGA; Mn; SACM; SnAgCu; drop test; reliability; solder; soldering; thermal cycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756450

Filename

6756450