• DocumentCode
    3477277
  • Title

    Improvement of microstructure and mechanical properties of Sn-58Bi alloy with La2O3

  • Author

    Lijiao Gao ; Jun Wang ; Tiesong Lin ; Peng He ; Fengjiao Lu

  • Author_Institution
    State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    193
  • Lastpage
    195
  • Abstract
    Sn-58Bi alloy particles and La2O3 were mechanically mixed and melted to prepare the composite solder. The microstructures of the solder and the IMC grain sizes were analyzed. Morphology results showed that the adding of La2O3 could restrain the segregation of Bi-rich phases and reduce the brittleness of the solder alloy. The hardness of solder increased with the addition of La2O3, which were tested by nano-indentation.
  • Keywords
    bismuth alloys; composite materials; lanthanum alloys; nanoindentation; shear strength; solders; tin alloys; IMC grain sizes; La2O3; SnBi; alloy particles; composite solder; mechanical properties; microstructure properties; nanoindentation; solder alloy; Grain size; Lead; Mechanical factors; Microstructure; Morphology; La2O3; Sn-58Bi; microstructure; shear strength;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756451
  • Filename
    6756451
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3477277