• DocumentCode
    3477497
  • Title

    SiC device technology for energy efficiency and high temperature operation

  • Author

    Ostling, Mikael

  • Author_Institution
    Sch. of ICT, KTH R. Inst. of Technol., Kista, Sweden
  • fYear
    2013
  • fDate
    3-5 June 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    This paper will give a brief overview of current state of the art device technology for SiC discrete devices and applications. The superior energy efficiency of SiC devices will be demonstrated and compared to its silicon counterparts.
  • Keywords
    power semiconductor devices; silicon compounds; wide band gap semiconductors; SiC; energy efficiency; high-temperature operation; silicon carbide device technology; silicon carbide discrete devices; Rectifiers; Reliability; Silicon Carbide; Switch; devices; high voltage; low loss; transistor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of
  • Conference_Location
    Hong Kong
  • Type

    conf

  • DOI
    10.1109/EDSSC.2013.6628179
  • Filename
    6628179