• DocumentCode
    3477518
  • Title

    Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint

  • Author

    Yang, L.M. ; Zhang, Z.F.

  • Author_Institution
    Shenyang Nat. Lab. for Mater. Sci., Inst. of Metal Res., Shenyang, China
  • fYear
    2013
  • fDate
    11-14 Aug. 2013
  • Firstpage
    247
  • Lastpage
    249
  • Abstract
    In this study, the influences of intermetallic compounds Cu6Sn5 at interface between solder and Cu substrate and Ag3Sn inside solder with different morphologies on the fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint were investigated. Cu6Sn5 grains became large in size with the increase of reflow time and aging procedure. Ag3Sn compounds appeared particle-like or branch-like morphologies as reflowed. However, some Ag3Sn compounds evolved into big rod-like shape after aging. The tensile results suggested that the strength of solder joint decreased with these evolvements of intermetallic compounds.
  • Keywords
    copper alloys; reflow soldering; silver alloys; solders; tin alloys; Ag3Sn; Cu6Sn5; Sn-Ag-Cu-Cu; aging procedure; branch-like morphologies; intermetallic compounds; particle-like morphologies; reflow time; solder joint; Aging; Compounds; Intermetallic; Joints; Morphology; Soldering; Substrates; Coarsening; Intermetallic compounds; Lead-free solder; Tensile strength;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
  • Conference_Location
    Dalian
  • Type

    conf

  • DOI
    10.1109/ICEPT.2013.6756464
  • Filename
    6756464
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3477518