Title :
Influences of intermetallic compounds morphologies on fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint
Author :
Yang, L.M. ; Zhang, Z.F.
Author_Institution :
Shenyang Nat. Lab. for Mater. Sci., Inst. of Metal Res., Shenyang, China
Abstract :
In this study, the influences of intermetallic compounds Cu6Sn5 at interface between solder and Cu substrate and Ag3Sn inside solder with different morphologies on the fracture behaviors of Sn-3Ag-0.5Cu/Cu solder joint were investigated. Cu6Sn5 grains became large in size with the increase of reflow time and aging procedure. Ag3Sn compounds appeared particle-like or branch-like morphologies as reflowed. However, some Ag3Sn compounds evolved into big rod-like shape after aging. The tensile results suggested that the strength of solder joint decreased with these evolvements of intermetallic compounds.
Keywords :
copper alloys; reflow soldering; silver alloys; solders; tin alloys; Ag3Sn; Cu6Sn5; Sn-Ag-Cu-Cu; aging procedure; branch-like morphologies; intermetallic compounds; particle-like morphologies; reflow time; solder joint; Aging; Compounds; Intermetallic; Joints; Morphology; Soldering; Substrates; Coarsening; Intermetallic compounds; Lead-free solder; Tensile strength;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756464
