Title :
Ion implant related trends in devices and process engineering
Author :
Greenwell, David W. ; Brown, Robert L.
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
Abstract :
This paper explores the trends for implant technology driven by the scaling of devices to smaller geometries. The progression conforms to the 1994 Silicon Industry Association (SIA) roadmap projections. The discussion moves from device structure to process constraints to implant tool requirements
Keywords :
ion implantation; Silicon Industry Association roadmap; device scaling; ion implantation technology; process engineering; Annealing; Conducting materials; Contamination; Geometry; Implants; Indium; Isolation technology; Microelectronics; Silicon; USA Councils;
Conference_Titel :
Ion Implantation Technology. Proceedings of the 11th International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3289-X
DOI :
10.1109/IIT.1996.586096
