A study of underfill using two kinds of silica as inorganic filler

Author

Wenjie Zhang ; Pengli Zhu ; Tao Zhao ; Rong Sun ; Chingping Wong

Author_Institution

Shenzhen Inst. of Adv. Technol., Shenzhen, China

fYear

2013

fDate

11-14 Aug. 2013

Firstpage

296

Lastpage

300

Abstract

In this paper, two kinds of silica prepared via dry chemical route (SiO₂-d) and wet chemical (SiO₂-w) method are used as potential CTE reducing fillers. The influence of adding silica on composite underfills´ properties such as CTE, modulus, and glass transition temperature (Tg) are investigated. The addition of silica fillers could reduces CTE and improves the modulus of the epoxy. Compared with SiO₂-w, SiO₂-d shows a greater effect on lowering the CTE values and improving the modulus. The sample with 50wt% SiO₂-d loading has a low CTE1 of 46.0ppm/°C and a high Tg of 165.4°C, which will be suitable used as the underfill for the application of improving the reliability of IC packages by distributing the thermal stress.

Keywords

glass transition; integrated circuit packaging; integrated circuit reliability; silicon compounds; thermal expansion; thermal stresses; CTE reducing fillers; IC packages reliability; SiO2-d; SiO2-w; SiO₂; composite underfills properties; dry chemical route; epoxy modulus; glass transition temperature; silica fillers; temperature 165.4 C; thermal stress; wet chemical method; Chemicals; Curing; Flip-chip devices; Loading; Silicon compounds; Stress; Thermal stresses; CTE; Tg; Underfill; modulus; silica;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2013 14th International Conference on

Conference_Location

Dalian

Type

conf

DOI

10.1109/ICEPT.2013.6756475

Filename

6756475