Title :
A study of underfill using two kinds of silica as inorganic filler
Author :
Wenjie Zhang ; Pengli Zhu ; Tao Zhao ; Rong Sun ; Chingping Wong
Author_Institution :
Shenzhen Inst. of Adv. Technol., Shenzhen, China
Abstract :
In this paper, two kinds of silica prepared via dry chemical route (SiO2-d) and wet chemical (SiO2-w) method are used as potential CTE reducing fillers. The influence of adding silica on composite underfills´ properties such as CTE, modulus, and glass transition temperature (Tg) are investigated. The addition of silica fillers could reduces CTE and improves the modulus of the epoxy. Compared with SiO2-w, SiO2-d shows a greater effect on lowering the CTE values and improving the modulus. The sample with 50wt% SiO2-d loading has a low CTE1 of 46.0ppm/°C and a high Tg of 165.4°C, which will be suitable used as the underfill for the application of improving the reliability of IC packages by distributing the thermal stress.
Keywords :
glass transition; integrated circuit packaging; integrated circuit reliability; silicon compounds; thermal expansion; thermal stresses; CTE reducing fillers; IC packages reliability; SiO2-d; SiO2-w; SiO2; composite underfills properties; dry chemical route; epoxy modulus; glass transition temperature; silica fillers; temperature 165.4 C; thermal stress; wet chemical method; Chemicals; Curing; Flip-chip devices; Loading; Silicon compounds; Stress; Thermal stresses; CTE; Tg; Underfill; modulus; silica;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756475
